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this is information on a product in full production. september 2014 docid025635 rev 4 1/16 spwf01sa spwf01sc serial-to-wi-fi b/g/n intelligent modules datasheet - production data features ? 2.4 ghz ieee 802.11 b/g/n transceiver ? stm32 arm cortex-m3 ? multiple integrated flash memory options: ? 1.5 mb (spwf01sx.1y orderable parts) ? 512 kb (spwf01sx.2y orderable parts) ? 64 kb ram memory ? 32 khz xtal to support low power modes ? 16 gpios, serial port (uart, spi, i2c) interfaces available ? small form factor: 26.92 x 15.24 x 2.35 mm ? up to +18 dbm output power ? single voltage supply (3.3 v typ.) ? multiple antenna options: ? integrated antenna (spwf01sa.xy versions) ? integrated u.fl connector (spwf01sc.xy versions) ? industrial operating temperature range ? fcc/ce/ic certified ? rohs compliant ? surface mount pcb module applications ? smart appliances ? industrial control and data acquisition ? home automation and security systems ? wireless sensors ? cable replacement ? medical equipment ? machine-to-machine communication spwf01sa.11 spwf01sc.11 www.st.com
description spwf01sa, spwf01sc 2/16 docid025635 rev 4 1 description the spwf01sa and the spwf01sc intelligent wi-fi modules represent a plug and play and standalone 802.11 b/g/n solution for easy integration of wireless internet connectivity features into existing or new products. configured around a single-chip 802.11 transceiver with integrated pa and an stm32 32-bit microcontroller with an extensive gpio suite, the modules also incorporate timing clocks and voltage regulators. two different options exist based on the integrated flash memory. the spwf01sx.1y orderable parts integrate 1.5 mb of flash, while the spwf01sx.2y orderable parts integrate 512 kb of flash. the module is available either configured with an embedded micro 2.45 ghz ism band antenna (spwf01sa), or with an u.fl connector for external antenna connection (spwf01sc). with low power consumption and small form factor, the modules are ideal for fixed and mobile wireless applications, as well as challenging battery-operated applications. the spwf01sx.y1 orderable parts are released with an integrated full featured tcp/ip protocol stack with added web server and additional application service capabilities. the sw package also includes an at command layer interface for user-friendly access to the stack functionalities via the uart serial port. figure 1. block diagram stm32 f103 cw1100 b/g/n integrated pa filt er flash 1mb 32 khz 38 mhz supply 3.3 v uart gpios spwf01sx.1y stm32 f103 cw1100 b/g/n integrated pa filt er 32 khz 38 mhz supply 3.3 v uart gpios spwf01sx.2y
docid025635 rev 4 3/16 spwf01sa, spwf01sc general electrical specifications 16 2 general electrical specifications table 1. absolute maximum ratings parameter test condition/comment min. typ. max. unit voltage supply - -0.3 - 4.0 v vin for 5 v tolerant pins -0.3 5.5 v vin for all other pins -0.3 2.8 v storage temperature range -55 105 c table 2. operating conditions and input power specifications (1) 1. typical results are at room temperature only. parameter test condition/comment min. typ. max. unit operating temperature range industrial -40 85 c 3.3 v supply input supply voltage 3.3 v supply input 3.1 3.3 3.6 v standby corresponds to have both the micro and the radio in standby power states 5ua sleep corresponds to have the micro in stop power state and the radio in sleep power state <1 ma power state corresponds to have the micro active and the radio in sleep power state 15 ma idle radio is deactivated 13 ma not connected scanning cycle (average) 25 ma connected (rx, idle or active) correspond to have active both the processor and the radio refer to 18 dbm output power 80 ma connected (tx active) 250 (2) 2. max values are in the range of 400 ma and depend on operating conditions. ma
digital interface specifications spwf01sa, spwf01sc 4/16 docid025635 rev 4 3 digital interface specifications table 3. digital interface specifications, i/o pins parameter test condition/comment min. typ. max. unit inputs vih 1.6 - 2.8 v vil 0.9 v outputs voh ioh=4 ma 2.1 2.5 v vol iol=4 ma 0.4 v
docid025635 rev 4 5/16 spwf01sa, spwf01sc rf characteristics 16 4 rf characteristics table 4. rf characteristics parameter test condition/comment min. typ. max. unit 11b, 1 mbps -96 dbm rx sensitivity (1) 11b, 2 mbps -93 dbm 11b, 5.5 mbps -91 dbm 11b, 11 mbps -87 dbm 11g, 9 mbps -89.5 dbm 11g, 18 mbps -86 dbm 11g, 36 mbps -80 dbm 11g, 54 mbps -74.5 dbm 11n, mcs1, 13 mbps -86.5 dbm 11n, mcs3, 26 mbps -81.5 dbm 11n, mcs5, 52 mbps -74 dbm 11n, mcs7, 65 mbps -71 dbm channel-to-channel de-sensitivity ch1 to 14 11g, 54 mbps, 10%per 1 db maximum input signal ch7 11g, 54 mbps -20 dbm adjacent channel rejection 11mbps 38 dbc 9 mbps 20 dbc 54 mbps 4 dbc mcs1 24 dbc mcs7 3 dbc tx output power (1) 11b, 1 mbps @802.11b spectral mask 18.3 dbm 11b, 11 mbps 18.3 dbm 11g, 9 mbps @802.11g spectral mask 18.3 dbm 11g, 54mbps evm=-27db, 4.5% 13.7 dbm 11n, mcs1 @802.11n spectral mask 18.3 dbm 11n, mcs7 evm=-27 db 13.5 dbm on board antenna gain average -1.2 dbi external antenna gain sg901-1066 average including cable loss 2.8 dbi 1. output power and sensitivit ies are measured with a 50 ? connection at the antenna port.
pinout description spwf01sa, spwf01sc 6/16 docid025635 rev 4 5 pinout description table 5. pinout description signal name type pin number main function alternate functions (1) notes gpio - general purpose input/output gpio[0] i/o 16 general purpose input/output restore to factory settings (2) input pull down and 5v tolerant gpio[1] i/o 17 general purpose input/output input pull down and 5v tolerant gpio[2] i/o 19 general purpose input/output floating and 5v tolerant gpio[3] i/o 1 general purpose input/output input pull down and 5v tolerant gpio[6] i/o 22 general purpose input/output wake up/sleep inhibit (3) input pull down and 5v tolerant gpio[4] i/o 18 general purpose input/output uart3 receive data input (4) gpio[5] i/o 20 general purpose input/output uart3 transmit data output (4) gpio[7] i/o 13 general purpose input/output sta/mini ap switch (5) gpio[8] i/o 4 general purpose input/output uart2 transmit data output (4) gpio[9] i/o 7 general purpose input/output uart2 receive data input (4) gpio[11] i/o 11 gpio[12] i/o 12 general purpose input/output gpio[15] i/o 21 general purpose input/output monitoring purpose with no alternate function gpio[10] i/o 5 led drive, blinking while run gpio[13] i/o 15 led drive, wifi link up
docid025635 rev 4 7/16 spwf01sa, spwf01sc pinout description 16 gpio[14] i/o 14 led drive, power up uart pins rxd1 i 8 uart1 receive data input 5v tolerant txd1 o 6 uart1 transmit data output 5v tolerant cts1_dn i 9 uart1 clear to send input active low, 5v to l e r a n t rts1_dp o 10 uart1 request to send output active low, 5v tolerant reset resetn i 3 reset input active low for 5 ms with pull up to 2.5vdc. not 5v tolerant supply pins and paddle 3.3 v 24 voltage supply decouple with 10uf capacitor ground 23 ground ground paddle 25 ground add plenty of ground vias for thermal dissipation and ground return boot loader boot0 i 2 boot loader (6) 1. the activation of alt function depends upon the firmware version or upon the variable configuration. 2. to perform the factory reset of the variables, pin gpio0 must be high during powerup. 3. gpio function running when low power mode variable is enabled. 4. deprecated starting from the release 3.0 of at full stack 5. introduced with the release 3.0 of at full stack. to enable the statominiap switch the gpio[7] needs to be put low together with the hw reset 6. to enable the firmware download, pin boot0 needs to be high during power up. resetn need to be pulled low at least 5 ms to initiate the firmware download sequence. pin 26 to pin 30 are reserved and they can be left floating in the final design application tip as a general rule, when commutation issues may occur, we suggest to use a level translator to match the i/o pins voltage of the connected device. we suggest to export the resetn pin to the host processor. it is a useful design practice to recover unexpected behaviors using the hw reset. table 5. pinout description (continued) signal name type pin number main function alternate functions (1) notes
module reflow spwf01sa, spwf01sc 8/16 docid025635 rev 4 6 module reflow the spwf01sa and spwf01sc are surface mount modules with a 6-layer pcb. the recommended final assembly reflow profiles are indicated below. the soldering phase must be executed with care: in order to prevent an undesired melting phenomenon, particular attention must be paid to the setup of the peak temperature. the following are some suggestions for the temperature profile based on the ipc/jedec j- std-020c, july 2004 recommendations. figure 2. soldering profile table 6. soldering values profile feature pb-free assembly average ramp-up rate (t smax to t p ) 3 c/sec max preheat: ? temperature min. (t s min.) ? temperature max. (t s max.) ?time (t s min. to t s max) (ts) 150 c 200 c 60-100 sec critical zone: temperature t l time t l 217 c 60-70 sec peak temperature (t p ) 240 + 0 c time within 5 c of actual peak temperature (t p ) 10-20 sec ramp-down rate 6 c/sec time from 25 c to peak temperature 8 minutes max. am17477v1
docid025635 rev 4 9/16 spwf01sa, spwf01sc regulatory compliance 16 7 regulatory compliance rf compliance the rf certifications obtained are described in table 7 below. note: the sg901-1066 from sagrad inc. is the only approved antenna using the ufl connector version. fcc and ic this module has been tested and found to comply with the fcc part 15 and ic rss-210 rules. these limits are designed to provide reasonable protection against harmful interference in approved installations. this equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. however, there is no guarantee that interference may not occur in a particular installation. this device complies with part 15 of the fcc rules. operation is subject to the following two conditions: 1. the device must not cause harmful interference. and 2. the device must accept any interference received, including interference that may cause undesired operation. modifications or changes to this equipment not expressly approved by the party responsible for compliance may render void the user's authority to operate this equipment. modular approval, fcc and ic fcc id: vra-sg9011203 ic: 7420a-sg9011203 in accordance with fcc part 15, the modules spwf01sa and spwf01sc are listed above as a modular transmitter device. table 7. rf certification summary comment fcc id vra-sg9011203 on board antenna and external sg901-1066 with connector version ic id 7420a-sg9011203 on board antenna and external sg901-1066 with connector version etsi compliant approved with on board antenna and connector version
regulatory compliance spwf01sa, spwf01sc 10/16 docid025635 rev 4 labeling instructions when integrating the spwf01sa and spwf01sc into the final product, it must be ensured that the fcc labeling requirements specified below are satisfied. based on the public notice from fcc, the product into which the st transmitter module is installed must display a label referring to the enclosed module. the label should use wording like the following: contains transmitter module fcc id: vra-sg90112013 ic: 7420a-sg9011203 any similar wording that expresses the same meaning may also be used. ce this module complies with the following european emi/emc and safety directives and standards: ? en 300 328 v 1.8.1 (2012-06) ? en 301 489-17 v 2.2.1 (2012-09) & en301 489-1 v.1.8.1 (2008-04) ? en60950-1:2006 a1:2010 figure 3. ce certified
docid025635 rev 4 11/16 spwf01sa, spwf01sc package mechanical data 16 8 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 4. top view of the module shield ce logo shield
package mechanical data spwf01sa, spwf01sc 12/16 docid025635 rev 4 figure 5. bottom view of the module figure 6. wi-fi dimensions note: an antenna area of 217 x 520 mils must be free of any ground metalization or traces under the unit. the area extending away from the antenna should be free from metal on the pcb and housing to meet expected performance levels. pin 25 is the required paddle ground and is not shown in this diagram. board design reference fcc and ic ids model series name data matrix
docid025635 rev 4 13/16 spwf01sa, spwf01sc package mechanical data 16 figure 7. wi-fi footprint pcb design requires a detailed review of the center exposed pad. this pad requires good thermal conductivity. soldering coverage should be maximized and checked via x-ray for proper design. there is a trade-off between providing enough soldering for conductivity and applying too much, which allows the module to ?float? on the paddle creating reliability issues. st recommends two approaches, a large center via that allows excess solder to flow down into the host pcb with smaller vias around it, or many smaller vias with just enough space for the viscosity of the chosen solder/flux to allow some solder to flow into the smaller vias. either of these approaches must result in 60% or more full contact solder coverage on the paddle after reflow. st strongly encourages pcb layout teams to work with their ems providers to ensure vias and solder paste designs that will result in satisfactory performance.
ordering information spwf01sa, spwf01sc 14/16 docid025635 rev 4 9 ordering information note: refer to the user manual for a complete list of features and commands available in the wi-fi full stack. table 8. ordering information order codes description spwf01sa.11 wi-fi module with integrated antenna, 1.5 mb of flash and wi-fi full stack spwf01sc.11 wi-fi module with integrated u.fl connector, 1.5 mb of flash and wi-fi full stack spwf01sa.21 wi-fi module with integrated antenna, 512 kbytes of flash and wi-fi full stack spwf01sc.21 wi-fi module with integrated u.fl. connector 512 kbytes of flash and wi-fi full stack
docid025635 rev 4 15/16 spwf01sa, spwf01sc revision history 16 10 revision history table 9. document revision history date revision changes 05-dec-2013 1 initial release. 22-jan-2014 2 figure 3 has been modified. 16-apr-2014 3 updated with references to modules with reduced flash memory. 18-sep-2014 4 modified: figure 1 and table 3
spwf01sa, spwf01sc 16/16 docid025635 rev 4 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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